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NCP3126
Table 2. MAXIMUM RATINGS
Rating
Main Supply Voltage Input
Bootstrap Supply Voltage vs GND
Bootstrap Supply Voltage vs Ground (spikes ≤ 50 ns)
Bootstrap Pin Voltage vs V SW
High Side Switch Max DC Current
V SW Pin Voltage
Switching Node Voltage Excursion (200 m A)
Switch Pin voltage (spikes < 50 ns)
FB Pin Voltage
COMP/DISABLE
Low Side Driver Pin Voltage
Low Side Driver Pin Voltage (spikes v 200 ns)
Rating
Symbol
V IN
VBST
VBST spike
VBST ? V SW
IV SW
V SW
V SWLIM
V SWtr
VFB
VCOMP/DIS
VISET
VISET Spike
Symbol
Min
? 0.3
? 0.3
? 5.0
? 0.3
0
? 0.3
? 2.0
? 5.0
? 0.3
? 0.3
? 0.3
? 2
Rating
Max
15
15
35
15
3.0
30
35
40
5.5 < V CC
5.5 < V CC
15 < V CC
15 < V CC
Unit
V
V
V
V
A
V
V
V
V
V
V
V
Unit
Thermal Resistance, Junction ? to ? Ambient
Thermal Resistance, Junction ? to ? Case
Storage Temperature Range
Junction Operating Temperature
Lead Temperature Soldering (10 sec):
(Note 2)
(Note 3)
R q JA
R q JC
T stg
T J
RF
110
183
170
? 55 to 150
? 40 to 125
260 peak
° C/W
° C/W
° C
° C
° C
Reflow (SMD styles only) Pb ? Free
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The maximum package power dissipation limit must not be exceeded.
2. The value of q JA is measured with the device mounted on 1 in 2 FR ? 4 board with 1 oz. copper, in a still air environment with T A = 25 ° C. The
value in any given application depends on the user ’s specific board design.
3. The value of q JA is measured with the device mounted on minimum footprint, in a still air environment with T A = 25 ° C. The value in any given
application depends on the user ’s specific board design.
4. 60 ? 180 seconds minimum above 237 ° C.
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